this is information on a product in full production. august 2014 docid14250 rev 3 1/10 SMM4F high junction temperature transil? datasheet - production data features ? typical peak pulse power: ? 400 w (10/1000 s) ? 2.4 kw (8/20 s) ? stand off voltage range: from 5 v to 33 v ? unidirectional types ? low leakage current: ? 0.2 a at 25 c ? 1 a at 85 c ? operating t j max: 175 c ? jedec registered package outline ? rohs package ? halogen free molding compound complies with the following standards ? iec 61000-4-2 level 4: ? 15 kv (air discharge) ? 8 kv (contact discharge) ? mil std 883g-method 3015-7: class3 ? 25 kv (human body model) description the SMM4F transil series has been designed to protect sensitive equipment against electro-static discharges according to iec 61000-4-2, mil std 883 method 3015, and electrical over stress such as iec 61000-4-4 and 5. they are generally for surges below 400 w 10/1000 s. this planar technology makes it compatible with high-end equipment and smps where low leakage current and high junction temperature are required to provide reliability and stability over time. their low clamping voltages provide a better safety margin to protect sensitive circuits with extended life time expectancy. packaged in stmite flat, this minimizes pcb space consumption (footprint in accordance with ipc 7531 standard). transil is a trademark of stmicroelectronics. k a stmite flat (do216-aa flat) www.st.com
characteristics SMM4F 2/10 docid14250 rev 3 1 characteristics table 1. absolute ratings (t amb = 25 c) symbol parameter value unit v pp peak pulse voltage (iec 61000-4-2 contact discharge) 30 kv p pp peak pulse power dissipation (1) 1. for a surge greater than the maximum val ues, the diode will fail in short-circuit. t j initial = t amb 400 w p power dissipation on infinite heatsink t amb = 125 c 2.5 w i fsm non repetitive surge peak forward current for unidirectional types t p = 10 ms t j initial = t amb 30 a t stg storage temperature range -65 to +175 c t j operating junction temperature range -55 to +175 c t l maximum lead temperature for soldering during 10 s 260 c table 2. thermal resistances symbol parameter value unit r th(j-l) junction to leads 20 c/w r th(j-a) junction to ambient on pcb with recommended pad layout 250 table 3. electrical characteristics - parameter definitions (t amb = 25 c) symbol parameter v rm stand-off voltage v br breakdown voltage i r breakdown current v cl clamping voltage i rm leakage current @ v rm i pp peak pulse current t voltage temperature coefficient v f forward voltage drop r d dynamic resistance v cl v br v rm i rm i r i pp v i i f v f v cl v br v rm i rm i r i pp v i i f v f
docid14250 rev 3 3/10 SMM4F characteristics 10 figure 1. definition of i pp pulse table 4. electrical characteristics - parameter values (t amb = 25 c) type i rm max@v rm v br @i r (1) v cl @i pp 10/1000 s r d (2) 10/1000 s v cl @i pp 8/20 s r d (2) 8/20 s t (3) 25 c 85 c min typ max max max max a v v ma v a va 10-4/c SMM4F5.0a 10 50 5.0 6.46 6.80 7.14 10 9.2 43.5 0.047 13.4 174 0.04 5.7 SMM4F6.0a 10 50 6.0 6.65 7.00 7.35 10 10.3 38.8 0.076 13.7 170 0.04 5.9 SMM4F6.5a 10 50 6.5 7.13 7.50 7.88 10 11.2 37.5 0.093 14.5 160 0.04 6.1 SMM4F8.5a 10 50 8.5 9.5 10.0 10.5 1 14.4 27.7 0.141 19.5 124 0.07 7.3 SMM4F10a 0.2 1 10 11.4 12.0 12.6 1 17.0 23.5 0.187 21.7 106 0.09 7.8 SMM4F12a 0.2 1 12 13.3 14.0 14.7 1 19.9 20.1 0.259 25.3 91 0.12 8.3 SMM4F13a 0.2 1 13 14.3 15.0 15.8 1 21.5 18.6 0.309 27.2 85 0.13 8.4 SMM4F15a 0.2 1 15 17.1 18.0 18.9 1 24.4 16.4 0.335 32.5 71 0.19 8.8 SMM4F18a 0.2 1 18 20.9 22.0 23.1 1 29.2 14.0 0.436 39.3 59 0.27 9.2 SMM4F20a 0.2 1 20 22.8 24.0 25.2 1 32.4 12.0 0.600 42.8 54 0.33 9.4 SMM4F24a 0.2 1 24 26.6 28.01 29.4 1 38.9 9.5 1.00 50 46 0.47 9.6 SMM4F26a 0.2 1 26 28.5 30.0 31.5 1 42.1 9.0 1.18 53.5 43 0.51 9.7 SMM4F28a 0.2 1 28 31.4 33.0 34.7 1 45.4 8.0 1.34 59.0 39 0.62 9.8 SMM4F33a 0.2 1 33 37.1 39.0 41.0 1 53.3 7.0 1.76 69.7 33 0.87 10.0 1. pulse test: t p <50ms. 2. to calculate maximum clamping voltage at other surge currents, use the following formula v clmax = r d x i pp + v brmax 3. to calculate v br versus junction temperature, use the following formula: v br @ t j = v br @ 25 c x (1 + t x (t j - 25)) 100 50 %i pp t r t p 0 t repetitive peak pulse current tr = rise time (s) tp = pulse duration time (s)
characteristics SMM4F 4/10 docid14250 rev 3 figure 4. clamping voltage versus peak pulse current (exponential waveform, maximum values) figure 2. peak power dissipation versus initial junction temperature figure 3. peak pulse power versus exponential pulse duration (t j initial = 25 c) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 0 25 50 75 100 125 150 175 200 p pp [t j initial] / p p p [t j init ial =25 c] t (c) j initial 0.1 1.0 10.0 1.0e-03 1.0e-02 1.0e-01 1.0e+00 1.0e+01 t j initial = 25 c t (ms) p p (kw) pp 0 1 10 100 1000 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 t j initial=25 c SMM4F33a SMM4F24a SMM4F15a SMM4F5.0a tp = 8/20 s tp = 10/1000 s i pp (a) v cl (v)
docid14250 rev 3 5/10 SMM4F characteristics 10 figure 9. leakage current versus junction temperature (typical values) figure 5. junction capacitance versus reverse applied voltage (typical values) figure 6. peak forward voltage drop versus peak forward current (typical values) 10 100 1000 10000 1 10 100 f=1 mhz v osc =30 mv rms t j =25 c SMM4F5.0a SMM4F15a SMM4F24a SMM4F33a c(pf) v (v) r 1.0e-02 1.0e-01 1.0e+00 1.0e+01 1.0e+02 0.0 0.5 1.0 1.5 2.0 2.5 3.0 t j =25 c t j =125 c i (a) fm v (v) fm figure 7. relative variation of thermal impedance junction to ambient versus pulse duration (printed ciruit board fr4, s cu = 1 cm 2 ) figure 8. thermal resistance junction to ambient versus copper surface under each lead (printed circuit board fr4, e cu = 35 m) 0.00 0.01 0.10 1.00 1.0e-03 1.0e-02 1.0e-01 1.0e+00 1.0e+01 1.0e+02 1.0e+03 on recommended pad layout z th(j-a) /r th(j-a) t (s) p 40 60 80 100 120 140 160 180 200 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 r th(j-a) (c/w) s (cm ) cu 2 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 1.e+04 25 50 75 100 125 150 175 v r =v rm v br 11.7v v br >11.7v t (c) j i (na) r
ordering information scheme SMM4F 6/10 docid14250 rev 3 2 ordering information scheme figure 10. ordering information scheme sm m 4f xx a - tr surface mount package surge rating m = stmite package 4f = 400 w in flat package stand off voltage example - 12 = 12 v type a = unidirectional packaging tr = tape and reel
docid14250 rev 3 7/10 SMM4F package information 10 3 package information ? case: jedec do216-aa flat molded plastic over planar junction ? terminals: solder plated, solderable per mil-std-750, method 2026 ? polarity: for unidirectional types the band indicates cathode. ? flammability: epoxy is rated ul94v-0 ? rohs package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. table 5. stmite flat dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.80 0.85 0.95 0.031 0.033 0.037 b 0.40 0.55 0.65 0.016 0.022 0.026 b2 0.70 0.85 1.00 0.027 0.033 0.039 c 0.10 0.15 0.25 0.004 0.006 0.009 d 1.75 1.90 2.05 0.069 0.075 0.081 e 3.60 3.80 3.90 0.142 0.150 0.154 e1 2.80 2.95 3.10 0.110 0.116 0.122 l 0.50 0.55 0.80 0.020 0.022 0.031 l1 2.10 2.40 2.60 0.083 0.094 0.102 l2 0.45 0.60 0.75 0.018 0.024 0.030 l3 0.20 0.35 0.50 0.008 0.014 0.020 figure 11. stmite flat footprint dimensions figure 12. marking information e1 e c db l3 a l l1 l2 b2 0.85 0.63 2.00 millimeters (inches) 4.13 0.95 1.95 0.65 0.65 (0.033) (0.079) (0.037) (0.077) (0.026) (0.163) (.025) (.026) y w w x x x xxx: marking y: year ww: week cathode bar ( unidirectional devices only )
package information SMM4F 8/10 docid14250 rev 3 table 6. marking type marking SMM4F5.0a-tr 4ua SMM4F6.0a-tr 4ub SMM4F6.5a-tr 4uc SMM4F8.5a-tr 4ud SMM4F10a-tr 4ue SMM4F12a-tr 4uf SMM4F13a-tr 4ug SMM4F15a-tr 4uh SMM4F18a-tr 4uj SMM4F20a-tr 4uk SMM4F24a-tr 4um SMM4F26a-tr 4un SMM4F28a-tr 4uo SMM4F33a-tr 4uq
docid14250 rev 3 9/10 SMM4F ordering information 10 4 ordering information 5 revision history table 7. ordering information order code (1) 1. xx indicates stand-off voltage marking package weight base qty delivery mode SMM4Fxxa-tr see table 6. stmite flat 16.7 mg 12000 tape and reel table 8. document revision history date revision changes 29-nov-2007 1 first issue. 19-dec-2007 2 updated i pp and r d parameters in columns 10 and 11 of table 4 . 20-aug-2014 3 updated package name.
SMM4F 10/10 docid14250 rev 3 important notice ? please read carefully stmicroelectronics nv and its subsidiaries (?st?) reserve the right to make changes, corrections, enhancements, modifications, and improvements to st products and/or to this document at any time without notice. purchasers should obtain the latest relevant in formation on st products before placing orders. st products are sold pursuant to st?s terms and conditions of sale in place at the time of o rder acknowledgement. purchasers are solely responsible for the choice, selection, and use of st products and st assumes no liability for application assistance or the design of purchasers? products. no license, express or implied, to any intellectual property right is granted by st herein. resale of st products with provisions different from the information set forth herein shall void any warranty granted by st for such product. st and the st logo are trademarks of st. all other product or service names are the property of their respective owners. information in this document supersedes and replaces information previously supplied in any prior versions of this document. ? 2014 stmicroelectronics ? all rights reserved
|
